During electroplating, the metal gets deposited on the anode or the cathode?
During electroplating, metal gets deposited on cathode because the metal ions from cathode moves towards anode which is a positive electrode.
During electroplating of nickel on a substance, AQUEOUS NiSO4 is taken as electrolyte and current is passed . According to our book, the Ni2+ ions migrate to the cathode and take 2 electrons forming Ni metal on the cathode . Also, the Ni anode get decomposed as Ni2+ ions.
But, at the cathode, H+ ions must go and undergo reduction by gaining ions because H+ is lower than Ni2+ in the electrochemical series and H+ can gain electrons more readily because of its small atomic size. Then why Ni+2 ions go to cathode and undergo reduction?
Or should MOLTEN NiSO4 be taken as an electrolyte for electroplating of Nickel on a metal so that there are no H+ ions in the electrolyte and only Ni2+ ions go at cathode and get deposited on the metal ?
Which of the following is/are correct processes that take place at cathode and anode during electroplating?