Which of the following can be used as an electrolyte during copper plating?

Hydrochloric acid

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Iron sulphate

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Copper sulphate

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Sodium chloride

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Solution

The correct option is C Copper sulphate
Copper sulphate can be used as an electrolyte during copper plating. The copper plate, which is positively charged, will attract the negatively charged sulphate ions in the solution to form copper sulphate.

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Which of the following can be used as an electrolyte during copper plating?

The correct option is C Copper sulphateCopper sulphate can be used as an electrolyte during copper plating. The copper plate, which is positively charged, will attract the negatively charged sulphate ions in the solution to form copper sulphate.

The correct option is C Copper sulphate
Copper sulphate can be used as an electrolyte during copper plating. The copper plate, which is positively charged, will attract the negatively charged sulphate ions in the solution to form copper sulphate.